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Data centers can be kept cool by circulating fluid over plates atop high-temperature components or by submerging equipment in non-corrosive oil that does not conduct electricity.

Findings

Additional insights we found via IEEE Spectrum

  1. In direct-to-chip cooling techniques, heated fluid carries thermal energy away from chips to a heat exchanger, which transfers the energy to the environment and returns cooled fluid to the chips.

  2. During immersion cooling, a dielectric fluid with strong thermal properties can carry significant energy away from servers via direct contact, rather than through an intermediary plate.

  3. In both direct-to-chip and immersion methods, the involved fluid can provide additional cooling if designed to boil upon absorbing thermal energy from equipment.

  4. Because heated material rises and cooled material sinks, immersion systems can take advantage of natural circulation to cool equipment without noisy fans.

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